| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin compsn. to form such an insulating resin layer that when wire bonding is performed on a bonding pad formed on the insulating resin layer, connection failure of wire bonding is not caused and peeling between the insulating resin layer and a molding resin is prevented. SOLUTION: The insulating resin layer 1 which constitutes a multilayered circuit board consists of a photosensitive resin compsn. This photosensitive resin compsn. is prepared by adding methoxymethyl melamine to a photosensitive resin which consists of an epoxy resin compd. having at least one acryl- modified or methacryl-modified epoxy group, photopolymerizable monomers, photopolymn. initiator, filler, hardening agent and org. solvent. The amt. of the methoxymethyl melamine added is 0.1 to 1.9 equiv. to the epoxy resin compd. |
