发明名称 Verfahren zum Spalten einer spröden Platte sowie Vorrichtung zum Durchführen des Verfahrens
摘要 <p>A method and a device for cleaving a plate of a brittle material, such as, for example, glass, by means of a radiation beam repeatedly moving over the plate. The radiation beam is repeatedly passed over a desired track until the plate has been cleft along a desired line of rupture of the plate. <IMAGE></p>
申请公布号 DE69128370(D1) 申请公布日期 1998.01.22
申请号 DE1991628370 申请日期 1991.03.18
申请人 PHILIPS ELECTRONICS N.V., EINDHOVEN, NL 发明人 ZONNEVELD, MAARTEN HARM, NL-5656 AA EINDHOVEN, NL;DEKKER, JACOBUS NICOLAAS, NL-5656 AA EINDHOVEN, NL;VERKADE, GERRIT CORNELIS, NL-5656 AA EINDHOVEN, NL;FIERKENS, IRENEUS HENRICUS THEODORUS, NL-5656 AA EINDHOVEN, NL;VAN GENNIP, THEODORUS JOHANNES MARIA JACOBUS, NL-5656 AA EINDHOVEN, NL
分类号 B23K26/00;B23K26/06;B23K26/40;B28D1/22;C03B33/09;G02F1/1333;(IPC1-7):C03B33/09;H01L21/304;B26F3/06 主分类号 B23K26/00
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