发明名称 DEVICE FOR WET COATING, IN PARTICULAR PRINTED CIRCUIT BOARDS WITH LACQUER
摘要 The invention concerns a device for wet coating, in particular printed circuit boards with lacquer using at least one applicator roller (20,21) sparing at least one edge area of the printed circuit board. The device uses a ductor (R) situated between a lacquer reservoir and the printed circuit board that can move in an axial direction, one edge of which touches the applicator roller (20,21). The ductor (R) is designed so that in particular it is possible to also remove excess lacquer, for example photo-resistant lacquer from a multilayer board, from both longitudinal edges of the printed circuit board without any residue. This is also possible for multilayer boards of varying widths in particular. By laterally displacing the lacquer from the respective peripheral edges of both applicator rollers (20,21) that are to kept free of lacquer, this lacquer is directly fed back into a lacquer reservoir via the outer edge area of the pertaining applicator roller without leading to, as in previously known solutions, an accumulation of lacquer, dirtying and breaking-down of the machine.
申请公布号 WO9802252(A1) 申请公布日期 1998.01.22
申请号 WO1997DE01414 申请日期 1997.07.03
申请人 ROBERT BUERKLE GMBH;MAI, JOSEF 发明人 MAI, JOSEF
分类号 B05C1/08;B05C1/16;G03F7/16;H05K3/00;H05K3/06;H05K3/18 主分类号 B05C1/08
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