| 摘要 |
<p>A semiconductor switch die (30) is mounted on one face of a substrate (31) and has a temperature sensor (10) on the opposite face to monitor the temperature in the vicinity of the semiconductor die. A current sensor (4) and voltage sensor (5) supply signals to a processor (15) to calculate power dissipated by the semiconductor device. The processor calculates the temperature of the device itself from the measured temperature and the dissipated power. If this exceeds a preset limit, the switching device is opened to prevent damage.</p> |
