Electroless palladium plating composition,申请号EP19920402190-传众专利搜索

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发明名称	Electroless palladium plating composition
摘要
申请公布号	EP0526334(B1)	申请公布日期	1998.01.21
申请号	EP19920402190	申请日期	1992.07.30
申请人	OKUNO CHEMICAL INDUSTRIES CO. LTD	发明人	OTSUKA, KUNIAKI;TORIKAI, EIICHI;KAWAGISHI, SHIGEMITSU;OKUNO, KAZUYOSHI
分类号	C23C18/44;(IPC1-7):C23C18/44	主分类号	C23C18/44
代理机构		代理人
主权项
地址

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