Bonded ceramic metal composite substrates and circuit boards constructed therewith.

摘要

A bonded ceramic-metal composite substrate oomprising a ceramic substrate (1) having opposite surfaces and a copper sheet (2) having a face directly bonded to one of the surfaces of the ceramic substrate, wherein the median surface roughness (Ra) of the outer surface of the copper sheet is not greater than 3 mu m, and the maximum surface roughness (Rmax) of the outer surface of the copper sheet is not greater than 18 mu m. The invention improves the manufacturing reliability of various electronic devices such as semiconductor modules.