| 摘要 |
A microencapsulated adhesive and a method for producing that microencapsulated adhesive are disclosed. The adhesive is produced from a solvent-based adhesive composition such as a styrene butadiene rubber composition an acrylic. The solvent-based adhesive composition may be encapsulated by interfacial polymerization, gelatin/gum arabic coacervation or melamine/formaldehyde encapsulation. The solvent is removed from the microcapsules by heating or reduced pressure to form an adhesive that is non-tacky, but becomes tacky upon application of external forces, such as shearing. The microencapsulated adhesive composition may be used, among other applications, as an adhesive for stamps or envelopes.
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