THICK FILM PATTERN FORMING METHOD, SELECTING METHOD OF PATTERN FORMING MATERIAL, AND ITS SELECTING DEVICE

摘要

PROBLEM TO BE SOLVED: To easily recover chips of pattern forming material so as to make the use of it again in the thick film pattern forming method by means of sand blasting. SOLUTION: In a thick film pattern forming method where a pattern forming material 2 is formed over a substrate 1 up to a specified thickness in advance, and sand blasting is then processed by way of a sand blasting mask 6 for a required pattern, ferromagnetic fine particles 7 shall be used as an abrasive for sand blasting. Since the ferromagnetic fine particles can be attracted by magnets, only the abrasive material can thereby be separated with ease by removing it out of the mixture of the machined-off pattern forming material and the abrasive.