发明名称 COVER TAPE FOR CARRIER OF ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To heat-weld by a sufficient bonding force regardless of the presence/ absence of a release treatment on a carrier tape, or the difference in material, etc., by forming an adhesive layer of a composition of which the major components are at least one kind of an ethylene-αolefin copolymer or anαolefin copolymer, and an ethylenevinyl acetate copolymer. SOLUTION: An adhesive layer 4 is formed of a composition of which the major components are at least one kind of an ethylene-αolefin copolymer or anαolefin copolymer, and an ethylene-vinyl acetate copolymer, and is formed by an affixing of films being formed in advance or an extrusion-coating. The adhesive layer 4 can avoid an unfavorable bonding due to an insufficient thickness, by the extrusion. Also, it is assumed that a required addition of a lubricant may unfavorably react to the adhesion, but the bonding force and the separation smoothness are improved by the mixing of the ethylene-αolefin copolymer or theαolefin copolymer, and the adhesive layer 4 is not affected by the material of a carrier tape made of a plastic or the presence/absence of a release treatment, and shows an excellent adhesion.
申请公布号 JPH1017015(A) 申请公布日期 1998.01.20
申请号 JP19960186649 申请日期 1996.06.27
申请人 NITTO DENKO CORP 发明人 NAGASAKI KUNIO;OKUNO TOSHIMITSU;ICHIKAWA HIROKI;NAKANO ICHIRO
分类号 B65D73/02;B65D85/86;(IPC1-7):B65D73/02 主分类号 B65D73/02
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