| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer printed wiring board with improved fine patterning property and insulation adhesion property. SOLUTION: In a method, an insulation layer is formed on the entire or one part of an insulation substrate surface where a conductor circuit is formed, an electroless plating is formed on the surface of the insulation layer, patterning is made, the conductor circuit is formed, and the above steps are repeated, thus manufacturing a multilayer printed wiring board. At this time, before electroless plating is made onto the insulation layer surface after roughening the surface, the insulation layer surface is subjected to electrical copper plating as needed and then is heat-treated at 100-300 deg.C. |
