| 摘要 |
<p>PROBLEM TO BE SOLVED: To form the conductive film of a layer-built electronic component with a uniform and small thickness, reduce the size and cost of the component and improve the function and safeness of the component. SOLUTION: A process in which conductive films 5 are formed on a ceramic green sheet 2 which is formed on a long carrier film 1 ion its longitudinal direction, a process in which the carrier film 1 is separated from the ceramic green sheet 2 and a process in which a ceramic layer-built unit is composed of a plurality of the ceramic green sheets 2 on which the conductive films 5 are formed and is sintered are provided. The conductive film 5 forming process consists of a process in which a photosensitive film 3 is firmed by applying hydrophilic activating catalyst liquid containing copper oxalate, palladium salt and alkali solution onto the ceramic green sheet 2 and a light is applied to specific regions of the photosensitive film 3 to deposit metal palladium films 4 and the regions of the photosensitive film 3 to which the light is not applied are washed off with water and a process in which nonelectrytic plating is applied to the ceramic green sheet 2 on which the metal palladium film 5 are deposited.</p> |
