| 摘要 |
PROBLEM TO BE SOLVED: To reduce the strain due to the temp. stress by forming many gaps obliquely to the sides of a frame, with leaving inside portions adjacent to a closed space to absorb the mechanical strain due to the stress at heating because of the expansion coefficient difference between a substrate of a microelectromechanical functional device and a mounting board. SOLUTION: A flat upper and face of a frame 16 is bonded to a mounting board 20 by the face down mounting to form a closed space 100 near the surface of an electromechanical working part. The frame 16 has many gaps 17 oblique to the sides of the frame 16, with leaving an inside part adjacent to the space 100. This absorbs the mechanical strain due to the stress caused at heating or cooling, because of the thermal expansion coefficient difference between the mounting board 20 and the substrate 10 of the device. As a result, the strain due to the temp. stress is reduced. |
