| 摘要 |
<p>PROBLEM TO BE SOLVED: To thin a semiconductor device and reduce the cost by applying insulating paste on the rear plane of the thermosetting resin applied between the inner leads and bonding a semiconductor element to the inner lead. SOLUTION: A plurality of inner leads 12, thermosetting resin 16 and insulating paste 17 are provided. The thermosetting resin 16 is applied between the inner leads 12. The insulating paste 17 is applied on the rear plane of the inner lead 12 and on the rear plane of the thermosetting resin 16. The top plane of the semiconductor element 11 is bonded to the insulating paste 17, and an A1 pad 15 formed on the semiconductor element 11 is electrically connected to the inner lead 12 by gold wire 14. Then, the device is sealed with mold resin 18. Thus, member cost can be reduced compared with the case where the conventional insulating tape is used. The device can be also thinned.</p> |
