| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer printed wiring board with improved mass-production property that can punch a hole for keeping electronic components without cutting and machining an outermost-layer substrate in a method for manufacturing the multilayer printed wiring board with the hole for keeping electronic components and through holes by plating a conductor circuit after forming an outer-layer circuit. SOLUTION: A method has processes, 1) a lamination body 10 with a hole 2 for keeping electronic components is formed by performing lamination and adhesion while forming the hole 2 for keeping electronic components, 2) a resin 7 that can be dissolved and eliminated is filled into the hole 2 for keeping electronic components and a copper foil 6 is adhered to the surface of the lamination body 10 at a side where the exposed surface of the resin 7 is located, thus forming a multilayer plate, 3) a through hole is formed and is plated, 4) an outer-layer circuit is formed and at the same time the resin 7 is exposed, 5) the resin 7 is dissolved and eliminated and the hole 2 for keeping electronic components is opened, 6) a conductor circuit 5 in the hole 2 for keeping electronic components is plated. |
