SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE, AND METHOD FOR INSPECTING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To excellently connect a semiconductor element to an aluminum wiring pattern on an insulating substrate through a bump electrode formed by successively laminating an Au4 Al layer and thin Au film upon a gold bump. SOLUTION: A laminated film in which a thin Au film 8 is laminated upon an Au4 Al layer is formed on a bump 6 used for connecting a semiconductor element 2 to an aluminum wiring pattern 11 on a substrate 9. Therefore, only the Au film 8 on the outermost surface of the bump 6 and aluminum existing in the surface of the pattern 1 and its vicinity contribute to the connection to the bump 6 on which a Au-Al metal-tometal compound is formed. The aluminum in the lower section of the pattern 11 does not contribute to the solid-phase diffusion reaction with the surface of the bump 6, but stays in the original state. Therefore, the semiconductor element can be connected to the aluminum wiring pattern on the insulating substrate in an excellent state through the bump electrode.