发明名称 METHOD FOR FORMING RESIN SEALED SECTION OF ELECTRONIC PARTS
摘要 PROBLEM TO BE SOLVED: To clamp a die to a punch with a high torque by using a small-sized control motor having a low rated torque by clamping the die to the punch in a state where the motor is set at a torque higher than the rated torque and lowering the torque of the motor from the rated value after the die is maintained in the clamped state by means of a brake. SOLUTION: A die 7 is clamped to a punch 6 by pressing the die 7 against the punch 6 so as to hold a lead frame between the die 7 and punch 6 by moving the die 7 in the direction shown by the arrow by utilizing the thrust of a servo motor 3. The die 7 is clamped to the punch 6 when the torque of the motor 3 instantaneously becomes the maximum. Immediately after the clamping, the clamping force applied to the die 7 is maintained by holding a vertical screw 8b with a brake body 10 and, while the clamping force is maintained, the torque of the motor 3 is lowered from the rated torque. Therefore, a strong clamping force can be applied to the die 7 for a long time by using a small-sized servo motor which is less in parts cost and the power consumption when the servo motor is used can be suppressed.
申请公布号 JPH1012644(A) 申请公布日期 1998.01.16
申请号 JP19960160077 申请日期 1996.06.20
申请人 ROHM CO LTD 发明人 MURAKAMI TADASHI
分类号 B29C45/64;B29C45/02;B29C45/14;B29C45/76;B29L31/34;H01L21/56;(IPC1-7):H01L21/56 主分类号 B29C45/64
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