SEMICONDUCTOR MOUNTING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor mounting structure capable of effectively dissipating heat generated from a semiconductor element when jointing the semiconductor element to a wiring circuit board by flip-chip method. SOLUTION: A semiconductor element 1 is connected to a wiring substrate 3 by a flip-chip method through a bump electrode 2 formed at the electrode portion of the semiconductor element 1, and a heat transmitting plate 6 connecting the surface of the reverse side of the electrode portion of the semiconductor element 1 to the surface of the wiring circuit board 3 is provided. Also, the heat transmitting plate 6 should be constituted with a high-heat transmitting material selected at least from one of copper and aluminum.