OPTICAL SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an optical semiconductor device which can secure its reliability even when it is desired to form its package of thermoplastic resin. SOLUTION: Provided within a package section 35 formed with thermoplastic resin are lead frames 31 and 32 tip ends of which are disposed as arranged as spaced by a predetermined distance in a side-by-side positional relationship within the package section, an optical semiconductor element 33 mounted on the lead frame 31, and a bonding wire 34 which is connected at its one end with an electrode of the optical semiconductor or element 33 and is also connected at the other end with the lead frame 32. The lead frames 31 and 32 act to restrict the amount of thermoplastic resin flowing into a gap defined between the tip ends of the lead frames 31 and 32 when the package section 35 is formed by introducing the thermoplastic resin into a cavity 43.