发明名称 |
Linear polyamic acid, linear polyimide and thermoset polyimide |
摘要 |
Novel thermoset polyimide and composite materials comprising the thermoset polyimides and a fibrous reinforcement are prepared according to this invention. The thermoset polyimides are obtained by heat-treating a linear polyamic acid or a linear polyimide prepared by using 4,4'-bis(3-aminophenoxy)biphenyl and pyromellitic dianhydride as essential monomers or by adding 4,4'-diaminodiphenyl ether or 3,3',4,4'-biphenyltetracarboxylic dianhydride to the essential monomers and by end-capping the molecular chain end with an aromatic dicarboxylic anhydride having a carbon-carbon triple bond. The thermoset polyimides have essential excellent properties of thermoplastic polyimide and additionally has enhanced heat resistance and improved mechanical properties. The thermoset polyimide can be used to provide various kinds of composite materials for aircraft matrices, electric and electronic appliances and others.
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申请公布号 |
US5708128(A) |
申请公布日期 |
1998.01.13 |
申请号 |
US19960668836 |
申请日期 |
1996.06.24 |
申请人 |
MITSUI TOATSU CHEMICALS, INC. |
发明人 |
OIKAWA, HIDEAKI;TAMAI, SHOJI;OHTA, MASAHIRO;YAMAGUCHI, AKIHIRO |
分类号 |
C08G73/10;(IPC1-7):C08G69/26 |
主分类号 |
C08G73/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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