发明名称 Liquid metal pump and apparatus for use in cleaning and recycling solder
摘要 A liquid metal electromagnetic pump 17 operates by passing an electric current through the liquid metal in a direction transverse to an applied magnetic field and the longitudinal axis of the liquid metal flow pipe. The direction of the pump is reversible by reversing the electric current. It is used to transfer batches of contaminated solder from a reservoir 12 in a hot air solder leveller 11 to a treatment tank (TA or TB). Contamination of the solder is removed by a cleaning process and the liquid solder returned to the reservoir 12 after heating to the required process temperature.
申请公布号 US5707585(A) 申请公布日期 1998.01.13
申请号 US19960597025 申请日期 1996.02.05
申请人 AEA TECHNOLOGY PLC 发明人 WARD, THOMAS;SETTLE, DAVID JAMES;BROWN, ANTHONY JAMES
分类号 B23K3/08;C22B7/00;C22B25/06;(IPC1-7):C21C5/42 主分类号 B23K3/08
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