发明名称 |
RELEASE FILM SUPPLY MECHANISM IN RESIN MOLDING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To enable resin molding using a release film of high quality by accurately feeding and supplying the release film to a predetermined position of a mold. SOLUTION: This supply mechanism supplies a release film 20 to the predetermined position of a mold 10b by the cut-to-size sending of a roll to use the same in resin molding. In this case, a supply control mark forming means A forming a supply control mark becoming a standard detecting the sending position of the release film at every cut-to size sending of the release film 20b is provided and a detection means B detecting the cut-to-size position of the release film 20b on the sending designation side of the release film 20b is provided. |
申请公布号 |
JPH106358(A) |
申请公布日期 |
1998.01.13 |
申请号 |
JP19960162690 |
申请日期 |
1996.06.24 |
申请人 |
APIC YAMADA KK |
发明人 |
MIYAJIMA FUMIO;KUBOTA TOSHIHIKO |
分类号 |
B29C45/02;B29C45/14;B29L31/34;H01L21/56;(IPC1-7):B29C45/02 |
主分类号 |
B29C45/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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