发明名称 RELEASE FILM SUPPLY MECHANISM IN RESIN MOLDING APPARATUS
摘要 PROBLEM TO BE SOLVED: To enable resin molding using a release film of high quality by accurately feeding and supplying the release film to a predetermined position of a mold. SOLUTION: This supply mechanism supplies a release film 20 to the predetermined position of a mold 10b by the cut-to-size sending of a roll to use the same in resin molding. In this case, a supply control mark forming means A forming a supply control mark becoming a standard detecting the sending position of the release film at every cut-to size sending of the release film 20b is provided and a detection means B detecting the cut-to-size position of the release film 20b on the sending designation side of the release film 20b is provided.
申请公布号 JPH106358(A) 申请公布日期 1998.01.13
申请号 JP19960162690 申请日期 1996.06.24
申请人 APIC YAMADA KK 发明人 MIYAJIMA FUMIO;KUBOTA TOSHIHIKO
分类号 B29C45/02;B29C45/14;B29L31/34;H01L21/56;(IPC1-7):B29C45/02 主分类号 B29C45/02
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