发明名称 Lead forming and bending mechanism
摘要 <p>Four lead bending devices (40) are arranged so that they surround a shaping tool (31). A rotary arm (41) extends from wire support (43), at each device, with an arm guide underneath holding the rotary arm to prevent its deflection. The wire support is coupled to a drive unit (44). The arm rotation provides bending of the lead (1) end sections, with a third angle and a fourth angle such that the support face can get near the shaping punch (33) during its contact with the end sections. For the third angle, a flat housing body with the leads is fitted to the shaping tool, after the pre-bending step.</p>
申请公布号 DE19654703(A1) 申请公布日期 1998.01.08
申请号 DE1996154703 申请日期 1996.12.30
申请人 MITSUBISHI DENKI K.K., TOKIO/TOKYO, JP 发明人 MANABE, HIDEKAZU, TOKIO/TOKYO, JP;ISHIHARA, KAORU, TOKIO/TOKYO, JP
分类号 H01L23/50;H01L21/48;H05K13/00;(IPC1-7):H01L23/50 主分类号 H01L23/50
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