发明名称 |
Multilayer printed wiring board and process for manufacturing the same |
摘要 |
A multilayer printed wiring board wherein an inner-layer copper circuit is provided on one or both of the surfaces of an inner-layer substrate, and subsequent copper circuit is cumulatively provided through an insulating layer on the outside of the inner-layer copper circuit, characterized in that the inner-layer copper circuit has a cuprous oxide film formed on the surface thereof the insulating layer which remarkably facilitate the interlayer adhesion between the inner-layer copper circuit. This multilayer printed wiring board has high interlayer adhesiveness and moistureproofness without causing any haloing phenomena when soaked with an acidic solution. <IMAGE> <IMAGE> |
申请公布号 |
EP0741505(A3) |
申请公布日期 |
1998.01.07 |
申请号 |
EP19960106841 |
申请日期 |
1996.04.30 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
TSUYOSHI, HIRAOKI;SATOH, TETSURO |
分类号 |
H05K1/03;C09J163/00;H05K3/38;H05K3/46 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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