| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-reliability semiconductor device and its manufacturing method capable of preventing a semiconductor chip from exfoliating in the interface between a die attach pattern and an adhesive agent, even if heating is performed when a plastic ball grid array is damp, and capable of preventing the generating of a popcorn phenomenon as well, without lowering the thermal diffusability of a semiconductor chip. SOLUTION: The thermal via holes 15 of a circuit board 25 are filled up with epoxy resin 37. By filling up the thermal via holes 15 with the epoxy resin 37, and it becomes possible to prevent water having permeated a solder resist 23 on the underside of the circuit board 25 from passing through the thermal via holes 15 and staying in the vicinity of the underside of an adhesive agent 27. Besides, a metal film 39 is provided on the die attach pattern 17, and covers the upper surfaces of the thermal via holes 15. |
