| 摘要 |
PROBLEM TO BE SOLVED: To highly accurately polish a wafer, etc., while detecting recessed/ projecting parts, inclination, etc., on the surface by controlling operation of a polishing head based on detection results of a displacement sensor and providing a controller for controlling the rotation of a chuck and the parallel movement of an X slide. SOLUTION: An X slide 7 is provided with a displacement sensor 3 and a polishing head 4 fixed thereto in a position having the equal distance from the central point P of a chuck 2. The X slide 7 is moved and the displacement sensor 3 and the polishing head 4 are positioned in the end of a wafer 1 so that a controller 20 is started. Then, a motor in a rotary table 12 is driven so that the shape of the wafer 1 surface is detected by the displacement sensor 3, while the chuck 2 and the wafer 1 are rotated in the θdirection. When a part exceeding the tolerance is detected, the polishing head 4 is lowered by operation of a cylinder 6 so that the part is locally polished. |
