发明名称 Semiconductor device with particular metal silicide film
摘要 In a metal silicide film, excessive silicon is contained and precipitated in silicide grain boundaries thereof. The thus precipitated excessive silicon makes a diffusion path of impurities, which extends along WSi2 grain interfaces, discontinuous in the metal silicide film. As a result, the impurities do not diffuse laterally in the metal silicide film even after a heat treatment is performed.
申请公布号 US5705845(A) 申请公布日期 1998.01.06
申请号 US19950435479 申请日期 1995.05.05
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 FUJII, TOYOKAZU
分类号 H01L21/768;(IPC1-7):H01L29/76;H01L29/94;H01L31/062 主分类号 H01L21/768
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