发明名称 HOT-MELT ADHESIVE AND BONDING OF POLYOLEFIN MATERIAL
摘要 PROBLEM TO BE SOLVED: To obtain a hot-melt adhesive comprising an ethylene-based copolymer and a tackifying resin, free from any styrene-based copolymer, having a specific range of shear storage modulus, and causing no lowering of its melt viscosity and no deterioration of its coatability even after heated for a long time. SOLUTION: This hot-melt adhesive, which is suitable for bonding polyolefin materials, comprises an ethylene-based copolymer such as an ethylene-vinyl acetate copolymer and a tackifying resin such as a coumaron resin or coumaron- indene resin, contains no styrene-based copolymer, and has the shear storage modulus of the adhesive sheet made thereof of 1×10<6> to 5×10<7> Pa determined at 0 deg.C and a frequency of 14Hz using a shear viscoelastic spectrometer.
申请公布号 JPH101655(A) 申请公布日期 1998.01.06
申请号 JP19960152472 申请日期 1996.06.13
申请人 SEKISUI CHEM CO LTD 发明人 ZENKI YASUKAZU
分类号 C09J5/06;C09J123/00;C09J123/04;(IPC1-7):C09J123/04 主分类号 C09J5/06
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