发明名称 Metal envelope for electronic equipment
摘要 The envelope is made up of aluminium plates (P1,P2) cleaned and dried. The areas where the plates are to be glued together is then polished. An aluminium wire (F) is applied to one of the plates and stretched along its edge. A layer of is then applied to cover the wire. The two plates are then assembled together
申请公布号 FR2750538(A1) 申请公布日期 1998.01.02
申请号 FR19960008005 申请日期 1996.06.27
申请人 SOPRANO 发明人 POLOSSE BERNARD
分类号 H01R4/04;H01R13/658;(IPC1-7):H01R4/64;H05K5/02;H05K5/04;H05K9/00 主分类号 H01R4/04
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