| 摘要 |
<p>A flip chip integrated circuit package (10) which has a layer of nickel-boron (Ni-B) (26) on the contact pads (16) of the package substrate (14) and a layer of nickel-phosphorus (Ni-P) (36) on the pins (20) of the substrate (14). A layer of gold (28) is plated onto the layers of nickel. An integrated circuit (12) with a plurality of solder bumps (30) is plated onto the contact pads (16) of the substrate (14). The package (10) is heated to reflow the solder bumps (30), gold and nickel-boron into solder joints that attach the integrated circuit (12) to the substrate (14). The package (10) is then typically shipped and mounted to a printed circuit board (23) by soldering the pins (20) to the board (23).</p> |
