发明名称 |
COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD |
摘要 |
The present invention provides a copper-clad laminate characterized in that an electrolytic copper foil (1) on the glossy surface side (1a) of which a copper electrodeposit (2) is formed, is bonded at its glossy surface side (1a) to one side or each of both sides of a substrate (3), which has a fine-pitch wiring (circuit) pattern and exhibits a high etching factor. The present invention further provides a copper-clad laminate which can be suitably employed in the production of such a printed wiring board. <IMAGE> |
申请公布号 |
KR0127665(B1) |
申请公布日期 |
1997.12.30 |
申请号 |
KR19930015101 |
申请日期 |
1993.08.04 |
申请人 |
POLYCLAD LAMINATES INC. |
发明人 |
SADA, MUNEO;HIRASAWA, YUTAKA;YOSHIMURA, KATSUHIRO |
分类号 |
B32B15/08;C25D1/04;H05K1/09;H05K3/00;H05K3/38;(IPC1-7):H05K3/38 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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