发明名称 Fastenerless sealed electronic module
摘要 A die cast housing having an open side receives a circuit which seats on a housing ledge near the open side. An accelerometer and other components carried by the board are enclosed by the housing and board. The outer side of the circuit board is covered with an adhesive sealant compound which secures and seals the circuit board to the housing without fasteners for efficient structural transmissibility, and also structurally dampens the circuit board. A sheet metal cover over the open side inhibits electromagnetic interference. Lateral ports on the housing are aligned with connectors on the circuit board and permit coupling to the circuit board by mating connectors which seal the ports. The connectors have an interference fit with webs on the housing to permit thrust testing before the adhesive sealant is cured.
申请公布号 US5703754(A) 申请公布日期 1997.12.30
申请号 US19960606701 申请日期 1996.02.26
申请人 DELCO ELECTRONICS CORPORATION 发明人 HINZE, LEE R.
分类号 B60R16/02;B60R16/023;H05K5/00;H05K5/06;(IPC1-7):H05K1/18 主分类号 B60R16/02
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