CERAMIC SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURE THEREOF

摘要

A ceramic semiconductor package wherein metal crack arrestor patterns (48) are formed in the corners of the package thereby increasing the strength of the package and acting as a barrier to microcracks. The metal crack arrestor patterns (48) may be electrically and physically isolated from metal interconnect (42) lines in the package and also may be formed using the same processing steps that are used to form the metal interconnect lines (42).