发明名称 |
Resin compositions and printed circuit boards using the same |
摘要 |
<p>A resin composition as well as a printed circuit board using the same are disclosed. The resin composition is formed by dispersing powder of a cured heat-resistant resin powder soluble in acid or oxidizing agent into a matrix of an uncured photosensitive resin hardly soluble in acid or oxidizing agent, in which a coloring matter is added to the resin matrix and/or the heat-resistant resin powder. <IMAGE></p> |
申请公布号 |
EP0620703(B1) |
申请公布日期 |
1997.12.29 |
申请号 |
EP19940105576 |
申请日期 |
1994.04.11 |
申请人 |
IBIDEN CO, LTD. |
发明人 |
ASAI, MOTOO;KATO, RITSUKO |
分类号 |
G03F7/11;H05K1/02;H05K3/00;H05K3/18;H05K3/34;H05K3/38;H05K3/46;(IPC1-7):H05K3/46;G03F7/004 |
主分类号 |
G03F7/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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