发明名称 Method of making power substrate assembly
摘要 A fixture is provided for facilitating the fabrication of a motor controller of the type including a power substrate module and a control circuit board mounted to and electrically coupled to the power substrate module via a plurality of conductors. The fixture is preferably a ring-like structure made of epoxy-fiberglass laminate. Apertures for engaging and holding the conductors are provided in the fixture at locations corresponding to conducting pads on the power substrate module. For fabrication, the power substrate module and the fixture are preformed and solder is disposed on the conducting pads of the module. During fabrication, the conductors are inserted into the apertures in the fixture and the fixture and conductors are positioned over the preformed power substrate module to bring the conductors into contact with the conducting pads. The fixture and power substrate module are then passed through a reflow oven to melt the solder and complete the connection of the conductors to the module. The fixture is left in place and connections to the conductors, such as by installing a control circuit board, may be completed in subsequent process or assembly steps.
申请公布号 US5699609(A) 申请公布日期 1997.12.23
申请号 US19950421588 申请日期 1995.04.12
申请人 ALLEN-BRADLEY COMPANY, INC. 发明人 WIELOCH, CHRISTOPHER J.
分类号 H01L25/07;H02M7/00;H02P27/08;H05K1/14;H05K1/18;H05K3/30;H05K5/00;H05K7/14;(IPC1-7):H05K3/36 主分类号 H01L25/07
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