A wave soldering process and apparatus in which a localized low oxygen-containing atmosphere is provided at the point of contact of the solder wave and the substrate to be soldered by bubbling an inert gas through the solder wave. <IMAGE>
申请公布号
PH30880(A)
申请公布日期
1997.12.23
申请号
PH19880000504
申请日期
1995.05.05
申请人
BOC GROUP INC.
发明人
NAYAR, HARBHAJA, S.;SAXENA NEERAJ;WASICZKO, A.;ADAMS, SEAN, M.
