| 摘要 |
PROBLEM TO BE SOLVED: To easily cut a peripheral part of a resin film sucked to a pattern plate. SOLUTION: A cutting device of a resin film is provided with a Nichrome wire 6 which is arranged above a pattern plate 15 vertically movably, and connected to a power source to cut a peripheral part of a resin film F, and a sucking member 9 which is arranged above the pattern plate 15 in an elevating/lowering manner, located outside the Nichrome wire 6, extended therealong, and capable of sucking the resin film F, and the peripheral part of the resin film F is lifted by the sucking member 9, and brought into contact with the Nichrome wire 6 so as to be cut. |
