发明名称 HIGH PURITY HARD GOLD ALLOY AND METHOD OF MANUFACTURING SAME
摘要 Electronic member: in a trend for finer line using a high purity gold alloy wire, this gold alloy wire further improves breaking strength, hardness, heat resistance and the like as compared with a conventional gold allow wire, and achieves stable bonding with less scatter and disconnection. Further, the gold alloy wire increases dispersion of fine additive agents, improves electric conductivity and thermal conductivity, and enables automatic, high speed bonding having a less junction loop height. Such high purity hard gold alloy is also suitable for electronic members such as lead frame and the like. Dental member: a high purity gold alloy enhances hardness and tensile strength which are important mechanical properties, further improves heat resistance and tone, and provides dental, high purity hard gold alloy members which are well balanced. High purity golden-colored alloy: a high purity gold allow for high purity golden-colored, decorative members, electronic members, dental members and the like is available.
申请公布号 WO9747778(A1) 申请公布日期 1997.12.18
申请号 WO1997JP02014 申请日期 1997.06.11
申请人 OGASA, KAZUO 发明人 OGASA, KAZUO
分类号 A61K6/04;C22C5/02;C22F1/14 主分类号 A61K6/04
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