Verfahren zum Zusammenbau eines Leiterrahmens

摘要

A multi-layer lead frame (10) for a semiconductor device comprises a lead frame body (12) made from metal strip, a power supply plane (14) and a ground plane (16). The planes (14,16) are independent of the lead frame body (12), but laminated to the lead frame body (12) by means of adhesive films (18a,18b) which are coated directly on the planes (14,16) or the lead frame body (12), without using any insulative tape pieces. An insulative film (19) may also be provided between the lead frame body (12) and adjacent planes (14,16).