发明名称 LEAD FRAME
摘要 The semiconductor lead frame where a plurality of internal leads are arranged so as to be mutually connected corresponding to external leads of a plurality of tap tapes is comprised of a window bar supportting a tap tape to be installed in a position separated from a center part in a front end of a plurality of internal leads of the lead frame, and a plurality of supporters fixedly connecting the window bar to the lead frame.
申请公布号 KR0125966(B1) 申请公布日期 1997.12.18
申请号 KR19940016709 申请日期 1994.07.12
申请人 SAMSUNG ELECTRONICS CO.,LTD 发明人 OH, SE-HYUK
分类号 H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/50
代理机构 代理人
主权项
地址