The cantilever chip has a cantilever spring blade provided at its end with a diamond point, which is directly applied to the spring blade via a plasma deposition process. The spring blade may be provided with a diamond layer for modifying its mechanical characteristics. The diamond point and/or the cantilever spring blade may be doped for modifying its electrical characteristics, to allow the simultaneous measurement of the topography and the electrical surface characteristics.
申请公布号
DE19622701(A1)
申请公布日期
1997.12.18
申请号
DE1996122701
申请日期
1996.06.05
申请人
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V., 80636 MUENCHEN, DE