Flip-Chip Semiconductor device with test structure and method of manufacturing the same

摘要

A semiconductor device has a plurality of input/output terminals (102) formed on the inner region (1a) on a semiconductor substrate (1), and a plurality of die testing terminals (101) formed on the peripheral region (1b) on the semiconductor substrate, and the input/output terminals (102) and the die testing terminals (101) are connected to each other by a metal wiring layer (103). Die testing is performed by bringing probes projecting from a probe card into contact with the plurality of die testing terminals (101).