| 摘要 |
<p>A wafer scrubbing device (10) for cleaning the surfaces of a thin disk (W) disposed on a stationary spin chuck (14) employs a double brush arrangement (16) whereby brush (18) rotation induces rotation of the disk (W) to be cleaned and whereby the speed differential between the constant rotational speed of the brushes (18) and the variable rotational speed of the disk (W) due to the relative position of the brushes (18) on the disk (W) causes the scrubbing of both surfaces and the edge of the disk (W).</p> |
