ARRANGEMENT OF ELECTRONIC COMPONENTS ON A CARRIER STRIP

摘要

In order to increase the packing density of electronic components on carrier strips (leadframes), the components (1) are disposed on leadframes in a plurality of rows aligned parallel to one another in the longitudinal direction. In order to attain the densest packing, hitherto uniform optimized spacings were maintained between the components (1). This is problematic when a plastics covering or coating is to be provided. The electronic component arrangement described has spacings (4) which differ, viewed in the longitudinal direction of the leadframe, resulting in empty spaces sufficient for the passage of flowable plastics.