| 摘要 |
PROBLEM TO BE SOLVED: To provide a device and method for cleaning a mold capable of achieving the miniaturization of the device in a simple structure and, at the same time, capable of improving the maintenance and reducing manufacturing cost. SOLUTION: The device is provided with a mold 11 including an upper mold 9 and a lower mold 10, resin molded item conveying means 5 for taking up an resin molded item 12 from the inside of the mold 11 and conveying it outside the mold 11, and cleaning means 6 for cleaning the resin molded faces S1 and/or S2 in a manner that it engages with the resin molded item conveying means 5 and comes in contact with the resin molded faces S1 and/or S2 of at least one mold part of the upper mold 9 and lower mold 10 of the mold 11 at the delivery operation period of the molded item conveying means 5 for delivering the resin molded item 12. |
