| 摘要 |
To provide a method of fabricating, using thin-film processes only, a 1,600 dpi head with nozzles arranged two-dimensionally on a substrate, e.g., silicon wafer, a drive LSI, thin-film resistors and thin-film conductors are formed on the silicon wafer. Thereafter, ink channels and through-holes are formed by silicon anisotropic etching from both sides of the silicon wafer. After connecting the orifice plate to the silicon wafer, nozzles are formed in the orifice plate using photoetching.
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