发明名称 EQUIPMENT FOR SUPPORTING WORKPIECE IN SEPARATION FROM SUPPORT SURFACE OF WORKPIECE SUPPORTING CHUCK AND MANUFACTURE OF SEPARATED MASK
摘要 <p>PROBLEM TO BE SOLVED: To obtain a wafer separating mask for supporting a workpiece separately from a workpiece supporting chuck. SOLUTION: This wafer separating mask has a plurality of metal supporting members 112 deposited a support surface of a chuck body 108. This supporting member 112 holes a wafer 116 or other workpieces separately from the supporting surface of the chuck. The distance between the rear surface of the water and the chuck is restricted by the thickness of the supporting member 112. This distance must be larger than the expected diameter of contamination particle 110 on the surface of the chuck. If this is done, the contamination particles will not stick to the rear surface of a wafer during the treatment.</p>
申请公布号 JPH09327188(A) 申请公布日期 1997.12.16
申请号 JP19970051255 申请日期 1997.03.06
申请人 APPLIED MATERIALS INC 发明人 BUINSENTO II BAAKUHAATO;MAIKERU ENU SHIYUGAAMAN;HAWAADO II GURUUNESU
分类号 H02N13/00;B23Q3/15;H01L21/683;(IPC1-7):H02N13/00 主分类号 H02N13/00
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