SEMICONDUCTOR DEVICE SUBSTRATE, SEMICONDUCTOR DEVICE, CARD TYPE MODULE AND INFORMATION MEMORY

摘要

PROBLEM TO BE SOLVED: To form recesses into substrates, without spot facing, to reduce the production cost by adhering a first substrate to a second substrate having holes and forming wiring patterns for connecting chip connecting terminals to external connecting terminals through through-holes of both substrates. SOLUTION: Holes are bored through a second flat substrate 2 having no wiring pattern, using a die, etc., this substrate 2 is adhered with adhesives 3 to a first flat substrate 1 having no wiring pattern to form a substrate having recesses 4. Then through-holes 7 are bored through this substrate and plated with Au to form a wiring pattern for electric connection of chip connecting terminals 5 to external connecting terminals 6 through the through-holes 7. Thus it is possible to form recesses into the substrates, without spot facing, to reduce the production cost.