| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding tool which can reduce laser irradiation time and increase bonding speed by effectively using the thermal energy of a laser light in order to rise the temperature of the tip part of a bonding tool, and reducing loss of the heat to the upper part of a bonding tool. SOLUTION: When SiN is used as a tool tip part 26 at the bonding of inner lead, the whole part of a tool except the tool tip part 26 is constituted of low thermal conductivity material 27 made of zirconia which is far more excellent in thermal insulation than SiN. When the tool tip part 26 is irradiated with a laser light 13, losing of the heat to the upper part of the tool can be remarkably reduced by the effect of the low thermal conductivity material 27, as compared with the conventional tool wherein the whole part is formed of SiN. Thereby the temperature rise of the tool tip part 26 is accelerated, and bonding speed can be increased. |
