发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE, MANUFACTURING DEVICE, SIMULATION METHOD AND SIMULATOR
摘要 <p>PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device which enables a semiconductor device manufacturing process to be proceeded without a test piece as a desired process or while amendments being effected. SOLUTION: In a manufacturing method of a semiconductor device consisting of a plurality of processes, actual observation data in at least one of the plurality of processes is obtained. Prediction data in at least one of the plurality of processes is obtained by an abinitio molecular dynamics process simulator or a molecular dynamics simulator provided with empirical potential. Then, the prediction data and the actual observation data are compared and tested successively in an actual time. When a significant difference is recognized between a set value of a manufacturing process factor and a factor of the plurality of manufacturing processes gathered from the actual observation data according to the comparison and test, the manufacturing process factor is amended successively in an actual time.</p>
申请公布号 JPH09320919(A) 申请公布日期 1997.12.12
申请号 JP19960349773 申请日期 1996.12.27
申请人 TOSHIBA CORP 发明人 ONGA SHINJI;OKADA TAKAKO;TOMITA HIROSHI;YAMABE KIKUO;OKANO HARUO
分类号 H01L21/66;G06F17/00;G06F17/50;G06F19/00;G06Q50/00;G06Q50/04;H01L21/00;H01L21/02;H01L21/336;H01L29/78;(IPC1-7):H01L21/02 主分类号 H01L21/66
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