发明名称 RESIN COMPOSITION, ITS FILM AND ITS CURED PRODUCT
摘要 PROBLEM TO BE SOLVED: To obtain a resin composition which can give elaborate resistor, conductor, phosphor and diaphragm patterns for, e.g. a plasma display when they are developed and baked after exposure to ultraviolet rays by mixing a photopolymerizable resin with a metal powder, etc. SOLUTION: A photopolymerizable resin (A) is mixed with a non-reactive resin (A'), a diluent (B), a photopolymerization initiator (C), an ultraviolet absorber (D), a colorant (E), and a metal powder, a metal oxide or glass (F). Examples of component A include an aliphatic glycidyl ether (meth)acrylate described in Japanese Patent Laid-Open No.259528/1995 and a poly(meth)acrylate described in Japanese Patent Laid-open No.8-33099/1996. An example of component A' is polyethylene glycol polyester, and an example of component B is a reactive diluent or an organic solvent such as a half ester of a polycarboxylic acid anhydride. Examples of component F include Y2 O3 , Eu, YVO4 , Mn .Zn2 SiO4 , a copper powder, a silver powder and a glass powder having a particle diameter of 10μm or below. The obtained mixture is kneaded to obtain a resin composition for pattern formation, which is applied to various substrates to form patterns.
申请公布号 JPH09316148(A) 申请公布日期 1997.12.09
申请号 JP19960159278 申请日期 1996.05.31
申请人 NIPPON KAYAKU CO LTD 发明人 MORI SATORU;YOKOSHIMA MINORU
分类号 G03F7/004;C08F290/00;C08F299/00;C08J5/18;G03F7/027;H01J11/22;H01J11/24;H01J11/28;H01J11/34;H01J11/36;H01J11/38;H01J11/40;H01J11/42;H01J11/44 主分类号 G03F7/004
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